Wiring board, electronic device, and electronic module
AssigneeKYOCERA Corporation
InventorYuuya MATSUMOTO
Life of this patent
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AssigneeKYOCERA Corporation
InventorYuuya MATSUMOTO
Estimating the term…
A wiring board includes an insulation substrate having a first surface and a second surface, first and third external electrodes located at opposing corner portions along a first diagonal line of the first surface, second and fourth external electrodes located at opposing corner portions along a second diagonal line, a first connection electrode at least partially overlapping the first external electrode and connected to the first external electrode via a first through-hole conductor extending from the first surface toward the bottom surface of a recessed portion, and a second connection electrode at least partially overlapping the third external electrode and connected to the third external electrode via a second through-hole conductor extending from the first surface toward the bottom surface of the recessed portion.
A wiring board comprising:
A wiring board comprising:
Dependencies are inferred from the claim text.