Circuit board and semiconductor package having the same

A semiconductor package comprising:

• a build-up insulating layer including a plurality of insulating layers stacked along a vertical direction;
• a wiring layer disposed on an upper surface of the build-up insulating layer;
• a solder resist layer disposed on the wiring layer and including a through hole;
• a plurality of insulating members disposed on the solder resist layer and spaced apart from each other along a horizontal direction;
• and
• an electronic device disposed on the plurality of insulating members and including a plurality of terminals,
• wherein the wiring layer includes a plurality of pads overlapping the through hole of the solder resist layer along the vertical direction,
• wherein the electronic device overlaps the plurality of insulating members along the vertical direction,
• wherein the plurality of pads are electrically connected to the plurality of terminals of the electronic device, respectively,
• wherein the solder resist layer includes a plurality of overlapping regions overlapping the plurality of insulating members along the vertical direction, and
• wherein the through hole of the solder resist layer is disposed between the plurality of overlapping regions.