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US 2026/0129753 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChan Jin Park, Hyun Seok Yang, Myong Keun Jung, Eun Su Kwon
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Abstract
A printed circuit board includes a first insulating layer including a protrusion portion, and a metal layer disposed on the protrusion portion of the first insulating layer. A width of a lowermost portion of the protrusion portion is greater than a width of an uppermost portion of the protrusion portion.
Claims20
A printed circuit board comprising:
- a first insulating layer including a protrusion portion;
- and
- a metal layer disposed on the protrusion portion of the first insulating layer,
- wherein a width of a first end portion of the protrusion portion is greater than a width of a second end portion of the protrusion portion.
1 more element
Dependencies are inferred from the claim text.