H05K 2201/09072
Hole or recess under component or special relationship between hole and component
H05K2201/09072 (Hole or recess under component or special relationship between hole and component) appears on 496 US grants and 563 published applications in this corpus.
Search patents in H05K- Granted patents
- 496
- Published applications
- 563
- Assignees
- 362
- Inventors
- 1,394
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 5 | 0 |
| 1997 | 6 | 0 |
| 1998 | 7 | 0 |
| 1999 | 1 | 0 |
| 2000 | 15 | 0 |
| 2001 | 5 | 0 |
| 2002 | 9 | 13 |
| 2003 | 10 | 16 |
| 2004 | 8 | 20 |
| 2005 | 10 | 15 |
| 2006 | 9 | 21 |
| 2007 | 14 | 15 |
| 2008 | 11 | 30 |
| 2009 | 7 | 22 |
| 2010 | 15 | 11 |
| 2011 | 15 | 18 |
| 2012 | 10 | 17 |
| 2013 | 10 | 26 |
| 2014 | 12 | 20 |
| 2015 | 21 | 22 |
| 2016 | 23 | 21 |
| 2017 | 20 | 20 |
| 2018 | 24 | 27 |
| 2019 | 24 | 26 |
| 2020 | 32 | 33 |
| 2021 | 26 | 26 |
| 2022 | 18 | 31 |
| 2023 | 18 | 37 |
| 2024 | 26 | 29 |
| 2025 | 32 | 25 |
| 2026 | 21 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Light-emitting image sensing module and method for fabricating the same11 Aug 2026US 12,707,568 B2Medimaging Integrated Solution, Inc.
- Display device28 Jul 2026US 12,696,395 B2Samsung Display Co., Ltd.
- Printed circuit board assembly21 Jul 2026US 12,690,125 B2Mettler-Toledo AG
- Key module and keyboard14 Jul 2026US 12,683,098 B2Wistron Corporation
- Stepped package and recessed circuit board7 Jul 2026US 12,677,375 B2Intel Corporation
- Circuit board assembly and method of manufacturing the same27 Aug 2026US 2026/0255498 A1Avary Holding (Shenzhen) Co., Limited.
- Power conversion device20 Aug 2026US 2026/0246366 A1Mitsubishi Electric Mobility Corporation
- Deformable article20 Aug 2026US 2026/0247526 A1Sendance GmbH
- Manufacturing method for a mounting board and mounting board20 Aug 2026US 2026/0248020 A1Sony Semiconductor Solutions Corporation
- Semiconductor storage device6 Aug 2026US 2026/0231336 A1Kioxia Corporation
Most cited
By later US patents
- Rearview mirror constructed for efficient assembly308US 6,650,457 B2Gentex Corporation · 2003
- Long range optical reader243US 7,055,747 B2Hand Held Products, Inc. · 2006
- Optical reader having a plurality of imaging modules219US 7,219,843 B2Hand Held Products, Inc. · 2007
- Electrical component package comprising polymer-reinforced solder bump interconnection151US 5,120,678 AMotorola, Inc. · 1992
- Rearview mirror assembly construction135US 6,657,767 B2Gentex Corporation · 2003