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US 12,677,375 B2Granted
Stepped package and recessed circuit board
AssigneeIntel Corporation
InventorsMartin M. Chang, Tin Poay Chuah, Eng Huat Goh, Chu Aun Lim, Min Suet Lim
Life of this patent
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Abstract
An apparatus comprising a package comprising a first side to interface with at least one chip; and a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises a non-stepped portion comprising a first plurality of conductive contacts; and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts.
Claims16
An apparatus comprising:
- a package comprising:
- a first side to interface with at least one chip;
- and
- a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises:
- a non-stepped portion comprising a first plurality of conductive contacts;
- and
- a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts;
- wherein the package is to interface with a circuit board, wherein the circuit board comprises a non-recessed portion to interface with the non-stepped portion of the second side of the package;
- and a recessed portion to interface with the stepped portion of the second side of the package, wherein the circuit board comprises an electronic component on the non-recessed portion, wherein the electronic component is coupled to a plated through hole via, wherein the plated through hole via is to electrically conductively couple to a solder ball on the stepped portion of the package.
6 more elements
An apparatus comprising:
- a circuit board to interface with a package, the package comprising:
- a first side to interface with at least one chip;
- and a second side to interface with the circuit board, the second side opposite to the first side, wherein the second side comprises:
- a non-stepped portion comprising a first plurality of conductive contacts;
- and a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts;
- wherein the circuit board comprises a non-recessed portion to interface with the non-stepped portion of the second side of the package;
- and a recessed portion to interface with the stepped portion of the second side of the package, wherein the circuit board comprises an electronic component on the non-recessed portion, wherein the electronic component is coupled to a plated through hole via, wherein the plated through hole via is to electrically conductively couple to a solder ball on the stepped portion of the package.
4 more elements
A method comprising forming a package, wherein the package comprises:
- a first side to interface with at least one chip;
- and
- a second side to interface with a circuit board, the second side opposite to the first side, wherein the second side comprises:
- a non-stepped portion comprising a first plurality of conductive contacts;
- and
- a stepped portion that protrudes from the non-stepped portion, the stepped portion comprising a second plurality of conductive contacts;
- wherein the package is to interface with a circuit board, wherein the circuit board comprises a non-recessed portion to interface with the non-stepped portion of the second side of the package;
- and a recessed portion to interface with the stepped portion of the second side of the package, wherein the circuit board comprises an electronic component on the non-recessed portion, wherein the electronic component is coupled to a plated through hole via, wherein the plated through hole via is to electrically conductively couple to a solder ball on the stepped portion of the package.
5 more elements
Dependencies are inferred from the claim text.