Light-emitting image sensing module and method for fabricating the same

A method for fabricating a light-emitting image sensing module, comprising steps:

• providing a motherboard having a plurality of groups of cutting holes that penetrate the motherboard;
• installing a plurality of image sensors on the motherboard, and electrically connecting the image sensors with the motherboard, wherein positions of the plurality of groups of cutting holes are respectively corresponding to positions of the plurality of image sensors;
• installing a plurality of conductive wiring carriers on the motherboard, and electrically connecting the plurality of conductive wiring carriers with the motherboard, wherein positions of the plurality of conductive wiring carriers are respectively corresponding to the positions of the plurality of image sensors;
• respectively installing a plurality of light sources on tops of the plurality of conductive wiring carriers, and respectively electrically connecting the plurality of light sources with the plurality of conductive wiring carriers;
• providing a plurality of opaque lens barrels respectively corresponding to the plurality of image sensors, wherein each of the opaque lens barrels has a first hole and at least one second hole, which penetrate the opaque lens barrel, and wherein positions of the first hole and the at least one second hole are respectively corresponding to the positions of the image sensor and the conductive wiring carrier, and wherein a lens module is fixed in the first hole of each of the opaque lens barrels;
• installing the plurality of opaque lens barrels on the motherboard, using the first holes to sleeve the plurality of image sensors, and using the second holes to sleeve the plurality of conductive wiring carriers and the plurality of light sources, wherein the lens module is disposed above the image sensor corresponding to the lens module;
• and
• cutting the motherboard along the plurality of groups of cutting holes to obtain a plurality of light-emitting image sensing modules, wherein each of the light-emitting image sensing modules includes an installation circuit board, and also includes the image sensor, the conductive wiring carrier, the light source, the lens module and the opaque lens barrel, which are disposed on the installation circuit board.

A method for fabricating a light-emitting image sensing module, comprising steps:

• installing an image sensor on an installation circuit board, and electrically connecting the image sensor with the installation circuit board;
• installing at least one conductive wiring carrier on the installation circuit board, and electrically connecting the at least one conductive wiring carrier with the installation circuit board;
• installing at least one light source on a top of the at least one conductive wiring carrier, and electrically connecting the at least one light source with the at least one conductive wiring carrier;
• providing an opaque lens barrel, wherein the opaque lens barrel has a first hole and at least one second hole, which penetrate the opaque lens barrel, and wherein positions of the first hole and the at least one second hole are respectively corresponding to positions of the image sensor and the at least one conductive wiring carrier, and fixing a lens module in the first hole of the opaque lens barrel;
• and
• installing the opaque lens barrel on the installation circuit board, using the first hole to sleeve the image sensor, and using the at least one second hole to sleeve the at least one conductive wiring carrier and the at least one light source, wherein the lens module is disposed above the image sensor.