H05K 2201/09036
Recesses or grooves in insulating substrate
H05K2201/09036 (Recesses or grooves in insulating substrate) appears on 1,344 US grants and 1,468 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,344
- Published applications
- 1,468
- Assignees
- 627
- Inventors
- 3,247
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 16 | 0 |
| 1986 | 6 | 0 |
| 1987 | 13 | 0 |
| 1988 | 6 | 0 |
| 1989 | 10 | 0 |
| 1990 | 10 | 0 |
| 1991 | 14 | 0 |
| 1992 | 10 | 0 |
| 1993 | 9 | 0 |
| 1994 | 7 | 0 |
| 1995 | 9 | 0 |
| 1996 | 14 | 0 |
| 1997 | 12 | 0 |
| 1998 | 19 | 0 |
| 1999 | 18 | 0 |
| 2000 | 17 | 0 |
| 2001 | 18 | 8 |
| 2002 | 25 | 36 |
| 2003 | 28 | 44 |
| 2004 | 34 | 57 |
| 2005 | 27 | 67 |
| 2006 | 36 | 61 |
| 2007 | 49 | 64 |
| 2008 | 44 | 83 |
| 2009 | 31 | 64 |
| 2010 | 49 | 60 |
| 2011 | 47 | 51 |
| 2012 | 46 | 34 |
| 2013 | 32 | 38 |
| 2014 | 37 | 63 |
| 2015 | 54 | 88 |
| 2016 | 59 | 57 |
| 2017 | 67 | 61 |
| 2018 | 55 | 56 |
| 2019 | 64 | 50 |
| 2020 | 47 | 60 |
| 2021 | 47 | 71 |
| 2022 | 59 | 66 |
| 2023 | 53 | 73 |
| 2024 | 50 | 50 |
| 2025 | 48 | 57 |
| 2026 | 26 | 49 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Camera module29 Sep 2026US 12,750,575 B2LG Innotek Co., Ltd.
- Membrane circuit board1 Sep 2026US 12,727,079 B2Chicony Electronics Co., Ltd.
- Electronic device25 Aug 2026US 12,720,674 B2Innolux Corporation
- Efficient assembly for electrolytic capacitors on solid state drives25 Aug 2026US 12,720,682 B2SanDisk Technologies LLC
- High frequency module and communication device28 Jul 2026US 12,696,379 B2Murata Manufacturing Co., Ltd.
- Wiring board and method for producing same1 Oct 2026US 2026/0304607 A1KYOCERA Corporation
- Conductive substrate and manufacturing method thereof1 Oct 2026US 2026/0304616 A1DeepWave, Inc.
- Phase shifter assembly1 Oct 2026US 2026/0304625 A1Suzhou Luxshare Technology Co., Ltd.
- Wiring board1 Oct 2026US 2026/0304634 A1Shinko Electric Industries Co., Ltd.
- Wiring device, manufacturing method for wiring device, and redistribution layer1 Oct 2026US 2026/0305426 A1Dai Nippon Printing Co.Ltd.
Most cited
By later US patents
- Method of manufacturing a semiconductor package336US 7,185,426 B1Amkor Technology, Inc. · 2007
- Semiconductor package including top-surface terminals for mounting another semiconductor package212US 7,671,457 B1Amkor Technology, Inc. · 2010
- Integrated circuit substrate having laser-embedded conductive patterns and method therefor204US 6,930,256 B1Amkor Technology, Inc. · 2005
- Surface mount semiconductor package197US 6,204,554 B1International Rectifier Corporation · 2001
- Crushable bead on lead finger side surface to improve moldability183US 5,886,397 AInternational Rectifier Corporation · 1999