Wiring board
AssigneeShinko Electric Industries Co., Ltd.
InventorHiroya OKAMOTO
Life of this patent
Estimating the term…
Abstract
A wiring board includes an interconnect layer including a pad, a first insulating layer formed on the interconnect layer, a barrier interconnect formed on the first insulating layer and surrounding the pad in a plan view, a second insulating layer formed on the first insulating layer and covering at least an outer periphery of an upper surface of the barrier interconnect, and a cavity penetrating the second insulating layer and the first insulating layer and exposing an upper surface of the pad, wherein a bottom surface of the cavity is located inside an inner surface of the barrier interconnect in the plan view.
Claims13
A wiring board comprising:
- an interconnect layer including a pad;
- a first insulating layer formed on the interconnect layer;
- a barrier interconnect formed on the first insulating layer and surrounding the pad in a plan view;
- a second insulating layer formed on the first insulating layer and covering at least an outer periphery of an upper surface of the barrier interconnect;
- and
- a cavity penetrating the second insulating layer and the first insulating layer and exposing an upper surface of the pad,
- wherein a bottom surface of the cavity is located inside an inner surface of the barrier interconnect in the plan view.
Dependencies are inferred from the claim text.