Crushable bead on lead finger side surface to improve moldability
AssigneeInternational Rectifier Corporation
InventorPeter R. Ewer
Life of this patent
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Abstract
A surface mount semiconductor package employs locking elements for locking a plastic housing to a metal pad on which a semiconductor device is mounted. The package includes terminals having elongated crushable beads on their side surfaces adjacent the portions of the terminals just outside the plastic housing. The beads are crushed inwardly by a molding tool when it closes to provide a seal which prevents the molding plastic from bleeding out and over the sides of the terminals which extend beyond the housing and which could interfere with solder connection to the terminals.
Claims7
A surface mount semiconductor device package, comprising:
- a semiconductor device;
- a metal pad on which the semiconductor device is mounted;
- a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when it cures;
- at least one terminal being spaced away from and co-planar with the metal pad, the terminal having spaced apart side surfaces which define a thickness of the terminal;
- and
- at least one crushable bead disposed on each side surface of the terminal, each bead having a thickness corresponding with the thickness of the terminal and being sized and positioned such that a portion thereof is deformed by and conforms to a channel of a molding device when it receives the terminal to form the housing, the bead preventing the flowable material of the housing from bleeding into the channel of the molding tool.
Dependencies are inferred from the claim text.