Surface mount semiconductor package

A surface mount semiconductor package, comprising:

• a semiconductor device;
• a metal pad on which the semiconductor device is mounted, the metal pad including at least one slot disposed along an edge thereof;
• a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when cured, the slot of the metal pad accepting the flowable material of the housing and locking the metal pad to the housing when the housing cures;
• a cross bar;
• and
• at least first and second terminals, the first and second terminals being co-planar with and spaced away from the metal pad, the first and second terminals being spaced apart from one another and coupled together by the cross bar, the cross bar locking the metal pad, the first and second terminals and the housing together when the flowable material of the housing cures.

A surface mount semiconductor device package, comprising:

• a semiconductor device;
• a metal pad on which the semiconductor device is mounted;
• a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when it cures;
• and
• at least one terminal being spaced away from the metal pad and having one portion which is co-planar with the metal pad and an offset portion, the terminal including a notch disposed along a bottom edge of the co-planar portion for preventing the flowable material of the housing from bleeding onto a bottom surface of the co-planar portion while the housing cures.

A surface mount semiconductor device package, comprising:

• a semiconductor device;
• a metal pad on which the semiconductor device is mounted;
• a housing formed of a flowable material which bonds to the metal pad and encapsulates the semiconductor device when it cures;
• at least one terminal being spaced away from and co-planar with the metal pad;
• and
• at least one crushable bead disposed on a side surface of the terminal for preventing the flowable material of the housing from bleeding past a molding tool used to form the housing.