High frequency module and communication device

A high frequency module comprising:

• a mounting board that has a first main surface opposite to a second main surface;
• a power amplifier that is disposed on a main surface of either the first main surface or the second main surface of the mounting board;
• an electronic component that is disposed on the main surface of the mounting board on which the power amplifier is disposed;
• and
• a resin layer that is disposed at least between the power amplifier and the electronic component in a plan view from a thickness direction of the mounting board, wherein
• the power amplifier has a third main surface opposite to a fourth main surface in the thickness direction of the mounting board,
• the fourth main surface of the power amplifier is provided between the third main surface of the power amplifier and the main surface of the mounting board on which the power amplifier is disposed,
• a groove portion is formed at least between the power amplifier and the electronic component, in the resin layer,
• the groove portion includes a bottom portion positioned between the third main surface of the power amplifier and the main surface of the mounting board when the mounting board is viewed from a direction orthogonal to the thickness direction of the mounting board,
• wherein
• the high frequency module further comprises a second power amplifier, which is different from a first power amplifier, as the power amplifier,
• the second power amplifier is disposed on the main surface of the mounting board on which the first power amplifier is disposed and is disposed on a side of the first power amplifier with respect to the groove portion,
• the resin layer is provided to cover the first power amplifier and the second power amplifier,
• the second groove portion, which is different from a first groove portion, is provided between the first power amplifier and the second power amplifier in the resin layer as the groove portion, in a plan view from the thickness direction of the mounting board,
• a third groove portion, a fourth groove portion, a fifth groove portion, and a sixth groove portion, which are different from the first groove portion and the second groove portion, are provided in the resin layer,
• one end portion among both end portions of the second groove portion is connected to the first groove portion,
• the third groove portion extends in a direction away from the electronic component, from one end portion among both end portions of the first groove portion,
• the fourth groove portion is provided to connect the other end portion among the both end portions of the second groove portion and an end portion of the third groove portion,
• the fifth groove portion extends in a direction away from the electronic component, from the other end portion among the both end portions of the first groove portion,
• the sixth groove portion is provided to connect the other end portion among the both end portions of the second groove portion and an end portion of the fifth groove portion,
• the first groove portion, the second groove portion, the third groove portion, and the fourth groove portion are formed to surround the first power amplifier in the plan view from the thickness direction of the mounting board, and
• the first groove portion, the second groove portion, the fifth groove portion, and the sixth groove portion are formed to surround the second power amplifier in the plan view from the thickness direction of the mounting board.

A high frequency module comprising:

• a mounting board that has a first main surface opposite to a second main surface;
• a power amplifier that is disposed on a main surface of either the first main surface or the second main surface of the mounting board;
• an electronic component that is disposed on the main surface of the mounting board on which the power amplifier is disposed;
• and
• a resin layer that is disposed at least between the power amplifier and the electronic component in a plan view from a thickness direction of the mounting board, wherein
• the power amplifier has a third main surface opposite to a fourth main surface in the thickness direction of the mounting board,
• the fourth main surface of the power amplifier is provided between the third main surface of the power amplifier and the main surface of the mounting board on which the power amplifier is disposed,
• a groove portion is formed at least between the power amplifier and the electronic component, in the resin laver,
• the groove portion includes a bottom portion positioned between the third main surface of the power amplifier and the main surface of the mounting board when the mounting board is viewed from a direction orthogonal to the thickness direction of the mounting board,
• wherein
• the resin layer is provided to cover the electronic component,
• the high frequency module further comprises an electronic component side shield portion that covers at least a part of the resin layer,
• the electronic component side shield portion has at least an electronic component side first shield surface and an electronic component side second shield surface,
• the electronic component side first shield surface overlaps the electronic component in a plan view from the thickness direction of the mounting board,
• the electronic component side second shield surface covers, among a first side wall and a second side wall of the resin layer that faces the first side wall in a direction in which the power amplifier and the electronic component are arranged and that form the groove portion, the second side wall that is closer to the electronic component than the first side wall, and
• at least a part of the electronic component is in contact with the electronic component side shield portion.