Efficient assembly for electrolytic capacitors on solid state drives

A semiconductor device, comprising:

• a printed circuit board (PCB) substrate, comprising:
• a plurality of contact fingers configured to electrically couple the semiconductor device to a host device;
• a first opening fully through the substrate;
• one or more pin slots partially through a first surface of the substrate and extending laterally from a first side of the first opening, each of the pin slots lined with a conductive coating;
• a notch slot partially through the first surface of the substrate and extending laterally from a side of the first opening opposing the first side of the first opening;
• one or more semiconductor dies mounted on the first surface of the substrate and electrically coupled to the contact fingers and to the conductive coating of one or more of the pin slots;
• and
• an electrical circuit device within the first opening, comprising:
• one or more pins extending from a first side of the electrical circuit device located in a corresponding one of the pin slots and electrically coupled to the conductive coating thereof;
• and
• an insulator notch extending outward from a side of the electrical circuit device opposite the first side of the electrical circuit device located and resting in the notch slot.