H05K 2201/09109
Locally detached layers
Official title: Locally detached layers, e.g. in multilayer
H05K2201/09109 (Locally detached layers) appears on 129 US grants and 103 published applications in this corpus.
Search patents in H05K- Granted patents
- 129
- Published applications
- 103
- Assignees
- 89
- Inventors
- 299
- Latest grant
- 8 Apr 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 4 | 0 |
| 1993 | 5 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 6 | 0 |
| 2002 | 3 | 3 |
| 2003 | 2 | 7 |
| 2004 | 4 | 9 |
| 2005 | 5 | 1 |
| 2006 | 5 | 6 |
| 2007 | 0 | 8 |
| 2008 | 6 | 5 |
| 2009 | 3 | 10 |
| 2010 | 7 | 9 |
| 2011 | 5 | 10 |
| 2012 | 7 | 2 |
| 2013 | 5 | 4 |
| 2014 | 2 | 1 |
| 2015 | 3 | 2 |
| 2016 | 2 | 0 |
| 2017 | 2 | 6 |
| 2018 | 3 | 4 |
| 2019 | 5 | 1 |
| 2020 | 3 | 2 |
| 2021 | 1 | 3 |
| 2022 | 2 | 6 |
| 2023 | 3 | 1 |
| 2024 | 2 | 2 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for producing a carrier arrangement8 Apr 2025US 12,273,993 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Flexible electric circuit for ultrasound catheters and related devices and methods21 May 2024US 11,986,351 B2St. Jude Medical, Cardiology Division, Inc.
- Camera module and electronic device including the same26 Mar 2024US 11,943,538 B2Samsung Electronics Co., Ltd.
- Device having circuit members between overlapping sealing members24 Oct 2023US 11,800,654 B2Japan Aviation Electronics Industry, Limited
- Signal transmission line including a flexible resin laminate having interior hollow portions overlapping the signal transmission line with the hollow portions having a vent hole23 May 2023US 11,658,376 B2Murata Manufacturing Co., Ltd.
- Method for producing a carrier arrangement19 Jun 2025US 2025/0203764 A1c/o Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Flexible electronic circuit for ultrasound catheters and related devices and methods15 Aug 2024US 2024/0268790 A1St. Jude Medical, Cardiology Division, Inc.
- Method for producing a carrier arrangement4 Jul 2024US 2024/0224417 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Module package with coaxial lead assembly18 May 2023US 2023/0154833 A1Qorvo US, Inc.
- Flexible leds strips with staggered interconnects10 Nov 2022US 2022/0357025 A1Lumileds LLC
Most cited
By later US patents
- Laminated electronic module assembly131US 5,179,501 AMotorola, Inc. · 1993
- Flexible printed circuit board having a metal substrate120US 5,266,746 AMitsui Toatsu Chemicals, Inc. · 1993
- Flexible printed circuits and methods of fabricating and forming plated thru-holes therein105US 4,715,928 A1987
- Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces105US 5,804,771 AIntel Corporation · 1998
- Flexible circuitized interposer with apertured member and method for making same105US 5,984,691 AInternational Business Machines Corporation · 1999