Module package with coaxial lead assembly

A method for forming a module package comprising:

• providing a base;
• providing at least one component on the base;
• and
• providing a housing over the base and encompassing the at least one component;
• at least one coaxial lead assembly that extends out of the housing and facilitates electrical connections with the at least one component, the at least one coaxial lead assembly comprises a dielectric structure, a central conductor, and an outer conductor formed by a top wall extending between two side walls wherein:
• the central conductor is between the two side walls, and
• the dielectric structure resides between the central conductor and the outer conductor such that the central conductor and outer conductor are isolated from one another.

A communication device comprising:

• a control system;
• transmit circuitry associated with the control system and comprising a module package for amplifying a radio frequency signal, the module package comprising:
• a base;
• at least one component on the base;
• a housing over the base and encompassing the at least one component;
• and
• at least one coaxial lead assembly that extends out of the housing and facilitates electrical connections with the at least one component, the at least one coaxial lead assembly comprises a dielectric structure, a central conductor, and an outer conductor formed by a top wall extending between two side walls wherein:
• the central conductor is between the two side walls, and
• the dielectric structure resides between the central conductor and the outer conductor such that the central conductor and outer conductor are isolated from one another.