Organic substrate (PCB) slip plane "stress deflector" for flip chip deivces
AssigneeIntel Corporation
InventorsJohn F. McMahon, Ravi Mahajan
Life of this patent
Estimating the term…
Abstract
A flip chip integrated circuit package which provides stress relief for the solder bumps of the package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is attached to a plurality of bond pads of the substrate by a number of corresponding solder bumps. The substrate has a first layer that is attached to a second layer. An area that is located between the layers and adjacent to the bond pads is left unattached so that a portion of the first layer can move independent of the remaining portion of the substrate. The unattached area allows the integrated circuit to "float" and expand at a different rate than the substrate when the package is thermally cycled.
Claims9
A substrate for an integrated circuit package assembly, comprising:
- a substrate which has a plurality of bond pads, said substrate including a first layer that is attached to a second layer such that there is an area adjacent to said bond pads where said first layer is unattached to said second layer;
- and,
- a shim that is located in said unattached area.
An integrated circuit package, comprising:
- a substrate which has a plurality of bond pads, said substrate including a first layer that is attached to a second layer such that there is an area adjacent to said bond pads where said first layer is unattached to said second layer;
- a shim that is located in said unattached area;
- and,
- an integrated circuit that is mounted to said bond pads of said substrate.
Dependencies are inferred from the claim text.