H05K 2201/09136
Means for correcting warpage
H05K2201/09136 (Means for correcting warpage) appears on 206 US grants and 300 published applications in this corpus.
Search patents in H05K- Granted patents
- 206
- Published applications
- 300
- Assignees
- 135
- Inventors
- 669
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 1 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 2 | 14 |
| 2009 | 3 | 22 |
| 2010 | 5 | 22 |
| 2011 | 6 | 21 |
| 2012 | 21 | 11 |
| 2013 | 10 | 10 |
| 2014 | 10 | 27 |
| 2015 | 12 | 18 |
| 2016 | 18 | 17 |
| 2017 | 17 | 18 |
| 2018 | 14 | 18 |
| 2019 | 14 | 14 |
| 2020 | 15 | 17 |
| 2021 | 18 | 13 |
| 2022 | 6 | 12 |
| 2023 | 9 | 18 |
| 2024 | 8 | 14 |
| 2025 | 13 | 8 |
| 2026 | 4 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board, light-emitting substrate, backlight module, display panel and display device21 Apr 2026US 12,610,675 B2Boe Technology Group Co., Ltd.
- Diminished printed circuit board (PCB) warpage14 Apr 2026US 12,604,392 B2Intel Corporation
- Wiring board10 Mar 2026US 12,575,029 B2Toppan Inc.
- Heat spreader apparatus with magnetic attachments on printed wiring board assemblies, related methods and electronic systems24 Feb 2026US 12,564,051 B2Micron Technology, Inc.
- Component carrier with embedded component on stepped metal structure with continuously flat bottom surface in at least one horizontal dimension2 Dec 2025US 12,490,371 B2
- Interconnect substrate and method of making same17 Sep 2026US 2026/0282212 A1Shinko Electric Industries Co., Ltd.
- Ceramic substrate and ceramic circuit board using same10 Sep 2026US 2026/0271182 A1Niterra Materials Co., Ltd.
- Circuit board and light-emitting substrate20 Aug 2026US 2026/0247767 A1Boe Technology Group Co., Ltd.
- Component Carrier With Inorganic Carrier Having Inserted Pin Directly Encapsulated in Through Hole5 Mar 2026US 2026/0068037 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Anti-warpage carrier25 Dec 2025US 2025/0393119 A1Kinsus Interconnect Technology Corp.
Most cited
By later US patents
- Warpage control stiffener ring package and fabrication method19US 8,986,806 B1Amkor Technology, Inc. · 2015
- Density-optimized module-level inductor ground structure15US 9,807,882 B1QUALCOMM Incorporated · 2017
- Wiring board and method for manufacturing the same12US 9,258,897 B2Ibiden Co., Ltd. · 2016
- Wiring board and electronic component device11US 8,334,461 B2Shinko Electric Industries Co., Ltd. · 2012
- Circuit carrier board structure and manufacturing method thereof10US 10,888,001 B2Unimicron Technology Corp. · 2021