Wiring board and method for manufacturing the same

A method for manufacturing a wiring board, comprising:

• preparing a laminated structure having a first-surface side pad configured to mount an electronic device on a first surface-side of the laminated structure and a solder resist layer on a second surface-side on an opposite side of the first surface-side;
• forming a recessed portion on the first surface-side of the laminated structure such that the first-surface side pad is exposed on a bottom surface of the recessed portion;
• forming a first opening portion on the second surface-side of the laminated structure such that a second-surface side pad is exposed on the second surface-side;
• and
• forming a second opening portion on the second surface-side of the laminated structure such that a portion of the laminated structure corresponding to a back face of the recessed portion is exposed on the second surface-side,
• wherein the forming of the second opening portion comprises forming the second opening portion on the second surface-side of the laminated structure such that the back face of the recessed portion does not include a pad on the second surface-side of the laminated structure, and the second opening portion has a depth which is a same as or less than a thickness of the solder resist.

A method for manufacturing a wiring board, comprising:

• preparing a laminated structure having a first-surface side pad configured to mount an electronic device in the laminated structure;
• forming a recessed portion on a first surface of the laminated structure such that the first-surface side pad is exposed on a bottom surface of the recessed portion;
• and
• forming a non-plated through hole in the laminated structure such that the non-plated through hole penetrates from the bottom surface of the recessed portion to a second surface of the laminated structure on an opposite side of the first surface of the laminated structure.