Component Carrier With Inorganic Carrier Having Inserted Pin Directly Encapsulated in Through Hole

A method of manufacturing a component carrier, wherein the method comprises:

• providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
• providing an inorganic carrier as part of the stack, wherein the inorganic carrier has a first main surface and an opposing second main surface;
• forming a through hole in the inorganic carrier extending between the first main surface and the second main surface;
• inserting at least one at least partially conductive pin in the through hole;
• and
• directly encapsulating the at least one at least partially conductive pin in the through hole by encapsulating material of at least one electrically insulating layer structure of the stack.