Circuit carrier board structure and manufacturing method thereof

A circuit carrier board structure, comprising:

• a first substrate having a first surface and a second surface opposite to the first surface, comprising:
• a plurality of first build-up layers that are sequentially stacked, wherein each of the first build-up layers comprises a first dielectric layer and a first circuit layer, and the first build-up layers are electrically connected to one another;
• a second substrate having a third surface and a fourth surface opposite to the third surface, comprising:
• a plurality of second build-up layers that are sequentially stacked, wherein each of the second build-up layers comprises a second dielectric layer and a second circuit layer, and the second build-up layers are electrically connected to one another;
• an adhesive layer located between the first substrate and the second substrate, wherein the second surface is combined to the third surface;
• and
• a plurality of connection pads located on the first surface and electrically connected to the first circuit layer,
• wherein the first substrate is electrically connected to the second substrate,
• wherein a linewidth of the first circuit layer is smaller than a linewidth of each of the connection pads,
• wherein the linewidth of the first circuit layer is less than or equal to 10 microns.