Density-optimized module-level inductor ground structure
AssigneeQUALCOMM Incorporated
InventorsDavid Francis Berdy, Changhan Hobie Yun, Niranjan Sunil Mudakatte, Mario Francisco Velez, Chengjie Zuo, Jonghae Kim
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Abstract
An integrated circuit (IC) device may include a first substrate having an inductor ground plane in a conductive layer of the first substrate. The integrated circuit may also include a first inductor in a passive device layer of a second substrate that is supported by the first substrate. A shape of the inductor ground plane may substantially correspond to a silhouette of the first inductor.
Claims20
An integrated circuit (IC) device, comprising:
- a first substrate including an inductor ground plane in a conductive layer of the first substrate;
- and
- a first inductor in a passive device layer of a second substrate that is supported by the first substrate, a shape of the inductor ground plane substantially corresponding to an outline of the first inductor.
A method of making an integrated circuit device, comprising:
- placing a second substrate, having a passive device layer including a first inductor, on a first substrate;
- and
- fabricating an inductor ground plane in a conductive layer of the first substrate, a shape of the inductor ground plane substantially corresponding to an outline of the first inductor.
A radio frequency (RF) front end module, comprising:
- a filter, comprising a first substrate including an inductor ground plane in a conductive layer of the first substrate, a first inductor in a passive device layer of a second substrate that is supported by the first substrate, and a second inductor in the passive device layer coupled to the first inductor, a shape of the inductor ground plane substantially corresponding to an outline of the first inductor and the second inductor;
- a diplexer coupled to the filter;
- and
- an antenna coupled to an output of the diplexer.
Dependencies are inferred from the claim text.