Wiring board and electronic component device
AssigneeShinko Electric Industries Co., Ltd.
InventorsYuichi Taguchi, Teruaki Chino, Kiyoshi Oi
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Abstract
A wiring board adapted for mounting an electronic component has the form of a structure in which a plurality of wiring layers are stacked one on top of another with an insulating layer interposed therebetween and are interconnected through via holes formed in the insulating layers, respectively. A plurality of openings are formed through the structure in a region where a wiring is not formed, extending through the structure in a thickness direction thereof. Further, solder resist layers are formed on the outermost wiring layers, respectively, and exposing pad portions defined in desired locations in the outermost wiring layers.
Claims8
A wiring board adapted for mounting an electronic component, comprising:
- a plurality of stacked wiring layers having an insulating layer interposed therebetween;
- a wiring forming region defined by a portion corresponding to a region where the electronic component is mounted;
- and
- a peripheral region around the wiring forming region,
- wherein, in the wiring forming region, the plurality of wiring layers are interconnected through a via hole formed in the insulating layer, and outermost wiring layers of the plurality of stacked wiring layers are provided on both surfaces of the wiring board, and wherein,
- in the peripheral region, a plurality of openings are formed in the insulating layer in a portion where a wiring of the wiring layer is not formed, with each opening being defined entirely by the insulating layer and being unfilled therein, and
- the plurality of openings extending from one outermost wiring layer to the other outermost wiring layer of the plurality of wiring layers of the wiring board in a thickness direction thereof.
Dependencies are inferred from the claim text.