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US 2026/0282212 A1Published application
Interconnect substrate and method of making same
AssigneeShinko Electric Industries Co., Ltd.
InventorsJun YOSHIIKE, Masahiro SUNOHARA, Noriyoshi SHIMIZU
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Abstract
An interconnect substrate includes a core layer made of glass having one surface, another surface opposite the one surface, and a first cut-out located on an outer side of the one surface, a first buffer layer filling the first cut-out, and a first insulating layer disposed on the one surface of the core layer and covering the first buffer layer, wherein the first buffer layer has a lower elastic modulus than the first insulating layer.
Claims15
An interconnect substrate comprising:
- a core layer made of glass having one surface, another surface opposite the one surface, and a first cut-out located on an outer side of the one surface;
- a first buffer layer filling the first cut-out;
- and
- a first insulating layer disposed on the one surface of the core layer and covering the first buffer layer,
- wherein the first buffer layer has a lower elastic modulus than the first insulating layer.
2 more elements
Dependencies are inferred from the claim text.