Diminished printed circuit board (PCB) warpage
AssigneeIntel Corporation
InventorsJonathan W. Thibado, John C. Gulick, Emery E. Frey
Life of this patent
Estimating the term…
Abstract
An apparatus is described. The apparatus includes a printed circuit board (PCB), a heating element and a layer of material that is physically integrated with a surface of the PCB. The layer of material is to apply an expansive or contractive force to a surface of the PCB in response to being warmed by heat generated by the heating element. The expansive or contractive force is to cause the first surface to expand with a first coefficient of thermal expansion that is closer to a second coefficient of thermal expansion of an opposite surface of the PCB than the surface's coefficient of thermal expansion without the expansive or contractive force.
Claims18
An apparatus, comprising:
- a printed circuit board (PCB) having a first surface opposite a second surface;
- a plate coupled to the first surface of the PCB, the plate having a first coefficient of thermal expansion that is different than a second coefficient of thermal expansion of the first surface of the PCB;
- a fastener to couple the plate and the first surface of the PCB;
- and
- a heating element associated with the plate, the heating element selectively operable to induce a thermal characteristic of the plate to at least one of prevent or restrict the PCB from bowing.
An apparatus comprising:
- a circuit board having a first surface opposite a second surface;
- a heating element;
- and
- a metal anti-warping structure coupled to the circuit board, the metal anti-warping structure having coefficient of thermal expansion values to at least one of expand or contract at a different rate than at least one of the first surface or the second surface of the circuit board to apply at least one of an expansive or contractive force to the circuit board in response to being warmed by heat generated by the heating element, the at least one of the expansive or contractive force to at least one of prevent or restrict the circuit board from bowing, the anti-warping structure includes a first metal beam and a second metal beam, the first metal beam extends diagonally between opposing first corners of the circuit board, and the second metal beam extends diagonally between opposing second corners of the circuit board.
An apparatus comprising:
- a printed circuit board (PCB) having a first surface opposite a second surface, the first surface having a first coefficient of thermal expansion and the second surface having a second coefficient of thermal expansion, the first coefficient of thermal expansion greater than the second coefficient of thermal expansion;
- and
- a first anti-warping structure adjacent to the first surface of the PCB, the first anti-warping structure having a third coefficient of thermal expansion that is less than the first coefficient of thermal expansion, the first anti-warping structure including a first heating element, the first heating element selectively operable to generate heat to influence thermal characteristics of the first anti-warping structure such that the first anti-warping structure is to apply a contractive force to the first surface of the PCB in response to being warmed by heat generated by the first heating element, the contractive force to at least one of prevent or restrict the first surface of the PCB from bowing.
Dependencies are inferred from the claim text.