H05K 2201/09063
Holes or slots in insulating substrate not used for electrical connections
H05K2201/09063 (Holes or slots in insulating substrate not used for electrical connections) appears on 1,884 US grants and 2,143 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,884
- Published applications
- 2,143
- Assignees
- 1,003
- Inventors
- 4,569
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 5 | 0 |
| 1981 | 2 | 0 |
| 1982 | 7 | 0 |
| 1983 | 4 | 0 |
| 1984 | 1 | 0 |
| 1985 | 6 | 0 |
| 1986 | 1 | 0 |
| 1987 | 7 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 5 | 0 |
| 1991 | 10 | 0 |
| 1992 | 10 | 0 |
| 1993 | 15 | 0 |
| 1994 | 10 | 0 |
| 1995 | 20 | 0 |
| 1996 | 20 | 0 |
| 1997 | 14 | 0 |
| 1998 | 17 | 0 |
| 1999 | 26 | 0 |
| 2000 | 25 | 0 |
| 2001 | 31 | 14 |
| 2002 | 27 | 40 |
| 2003 | 28 | 36 |
| 2004 | 48 | 56 |
| 2005 | 28 | 67 |
| 2006 | 36 | 75 |
| 2007 | 48 | 66 |
| 2008 | 49 | 86 |
| 2009 | 42 | 81 |
| 2010 | 56 | 57 |
| 2011 | 47 | 66 |
| 2012 | 47 | 57 |
| 2013 | 53 | 83 |
| 2014 | 58 | 102 |
| 2015 | 55 | 94 |
| 2016 | 91 | 87 |
| 2017 | 89 | 81 |
| 2018 | 87 | 106 |
| 2019 | 109 | 109 |
| 2020 | 110 | 124 |
| 2021 | 98 | 137 |
| 2022 | 115 | 117 |
| 2023 | 96 | 109 |
| 2024 | 89 | 83 |
| 2025 | 85 | 66 |
| 2026 | 40 | 144 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power module15 Sep 2026US 12,739,974 B2Hyundai Motor Company
- Electronic device including a substrate with an electronic component and a heat emitting body disposed on respective surfaces of the substrate25 Aug 2026US 12,720,666 B2LG Innotek Co., Ltd.
- Efficient assembly for electrolytic capacitors on solid state drives25 Aug 2026US 12,720,682 B2SanDisk Technologies LLC
- Flow sensing device and associated method11 Aug 2026US 12,704,397 B2Honeywell International Inc.
- Line card, related apparatus, and control method11 Aug 2026US 12,706,995 B2Honor Device Co., Ltd.
- Display device24 Sep 2026US 2026/0292991 A1Samsung Display Co., Ltd.
- Circuit board, circuit board assembly and device including the same17 Sep 2026US 2026/0282210 A1LG Energy Solution, Ltd.
- Sensor interposer employing castellated through-vias17 Sep 2026US 2026/0282225 A1DexCom, Inc.
- Device and method for manufacturing solid fuel microthrusters using only pcb-mems technology10 Sep 2026US 2026/0264889 A1Universidad de Sevilla
- Printed circuit boards with arc reduction voids10 Sep 2026US 2026/0271177 A1Micron Technology, Inc.
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Foldable electronic assembly module210US 5,224,023 A1993
- Hybrid integrated circuit planar transformer191US 5,353,001 ABurr-Brown Corporation · 1994
- Stacked configuration for integrated circuit devices177US 5,117,282 AHarris Corporation · 1992
- Video tape recorder with a monitor-equipped built-in camera150US 5,442,453 ASharp Kabushiki Kaisha · 1995