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AssigneeMicron Technology, Inc.
InventorsBrilendra Murti Panta, Joao Elmiro da Rocha Chaves
Estimating the term…
Printed circuit boards with arc reduction voids are disclosed herein. In one embodiment, a printed circuit board (PCB) includes a conductor layer comprising an interconnect, a ground plane layer, and a layer including a void positioned between the conductor layer and the ground plane such that (a) the layer is devoid of any conductive elements positioned between the interconnect and the ground plane layer, and (b) the interconnect is electrically isolated from the ground plane layer. The void can be formed or filled by a non-conductive material, such as prepreg or core material. The void may have a footprint corresponding to the interconnect's footprint or span an area larger than the interconnect. Additional dielectric material sections can be positioned between the conductor layer and the void layer, the void layer and the ground plane, or a combination thereof.
A printed circuit board (PCB), comprising:
A memory module, comprising:
A layer arrangement for a printed circuit board (PCB), the layer arrangement comprising:
Dependencies are inferred from the claim text.