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US 12,739,974 B2Granted
Power module
AssigneesHyundai Motor Company, Kia Corporation
InventorsSe Yoon Jeong, Jun Hee Park, Suk Hyun Lim
Life of this patent
Estimating the term…
Abstract
A power module includes a first substrate formed by stacking a plurality of layers in a first axis direction, a semiconductor chip electrically connected to the first substrate, a printed circuit board connected to the semiconductor chip and comprising at least one step portion with a reduced thickness compared to the surrounding area in the first axis direction, and at least one metal block mounted on the at least one step portion in the first axis direction and electrically connected to the first substrate.
Claims17
A power module comprising:
- a first substrate, the first substrate comprising a plurality of layers that are stacked in a first axis direction;
- a semiconductor chip electrically connected to the first substrate;
- a printed circuit board connected to the semiconductor chip, the printed circuit board comprising at least one step portion that is recessed in the first axis direction and has a reduced thickness in the first axis direction less than a thickness of an area of the printed circuit board surrounding the at least one step portion;
- and
- at least one metal block disposed at the at least one step portion and electrically connected to the first substrate,
- wherein the printed circuit board is spaced apart from the first substrate in the first axis direction and faces the first substrate, and the semiconductor chip is disposed between the first substrate and the printed circuit board.
3 more elements
A power module comprising:
- a first substrate, the first substrate comprising a plurality of layers that are stacked in a first axis direction;
- a semiconductor chip electrically connected to the first substrate;
- a printed circuit board connected to the semiconductor chip, the printed circuit board comprising at least one step portion that is recessed in the first axis direction and has a reduced thickness in the first axis direction less than a thickness of an area of the printed circuit board surrounding the at least one step portion;
- and
- at least one metal block disposed at the at least one step portion and electrically connected to the first substrate,
- wherein the at least one step portion is defined at one side of the printed circuit board facing the first substrate,
- wherein the at least one metal block is positioned between the first substrate and the printed circuit board, and
- wherein the first substrate comprises at least one substrate step portion that is recessed away from the printed circuit board in the first axis direction, the at least one substrate step portion having a reduced thickness in the first axis direction that is less than a thickness of an area of the first substrate surrounding the at least one substrate step portion.
5 more elements
A power module comprising:
- a first substrate, the first substrate comprising a plurality of layers that are stacked in a first axis direction;
- a semiconductor chip electrically connected to the first substrate;
- a printed circuit board connected to the semiconductor chip, the printed circuit board comprising at least one step portion that is recessed in the first axis direction and has a reduced thickness in the first axis direction less than a thickness of an area of the printed circuit board surrounding the at least one step portion;
- at least one metal block disposed at the at least one step portion and electrically connected to the first substrate;
- and
- a second substrate spaced apart from the first substrate in the first axis direction, the second substrate comprising a plurality of layers stacked in the first axis direction,
- wherein the semiconductor chip is disposed between the first substrate and the second substrate, and
- wherein the at least one metal block is connected to at least one of the first substrate or the second substrate.
5 more elements
Dependencies are inferred from the claim text.