H05K 2201/09018
Rigid curved substrate
H05K2201/09018 (Rigid curved substrate) appears on 230 US grants and 222 published applications in this corpus.
Search patents in H05K- Granted patents
- 230
- Published applications
- 222
- Assignees
- 204
- Inventors
- 667
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 3 | 0 |
| 1994 | 4 | 0 |
| 1995 | 9 | 0 |
| 1996 | 3 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 0 |
| 2002 | 2 | 3 |
| 2003 | 3 | 2 |
| 2004 | 2 | 4 |
| 2005 | 3 | 6 |
| 2006 | 2 | 2 |
| 2007 | 1 | 6 |
| 2008 | 2 | 13 |
| 2009 | 2 | 6 |
| 2010 | 9 | 15 |
| 2011 | 7 | 6 |
| 2012 | 5 | 9 |
| 2013 | 6 | 1 |
| 2014 | 8 | 9 |
| 2015 | 5 | 13 |
| 2016 | 12 | 21 |
| 2017 | 9 | 12 |
| 2018 | 13 | 14 |
| 2019 | 19 | 16 |
| 2020 | 15 | 9 |
| 2021 | 7 | 11 |
| 2022 | 9 | 6 |
| 2023 | 11 | 17 |
| 2024 | 10 | 6 |
| 2025 | 14 | 13 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Solenoid assembly with included constant-current controller circuit3 Mar 2026US 12,567,526 B2Hanchett Entry Systems, Inc.
- Non-planar printed circuit board (PCB) interposer for doubly curved conformal antenna array23 Dec 2025US 12,506,283 B1Rockwell Collins, Inc.
- Manufacturing method of electronic device and electronic device4 Nov 2025US 12,464,652 B2Innolux Corporation
- Method for nondestructive reverse-engineering of layers of printed circuit board21 Oct 2025US 12,450,794 B2RJ Matthews LLC
- Authenticated health credential access methods and apparatus21 Oct 2025US 12,452,643 B2Ouraring Inc.
- Composite substrate25 Jun 2026US 2026/0181770 A1Murata Manufacturing Co., Ltd.
- Authenticated health credential access methods and apparatus22 Jan 2026US 2026/0025649 A1Ouraring Inc.
- Semiconductor package13 Nov 2025US 2025/0349698 A1Samsung Electronics Co., Ltd.
- Printed circuit board and electronic device comprising same13 Nov 2025US 2025/0351263 A1Samsung Electronics Co., Ltd.
- Printed circuit board2 Oct 2025US 2025/0311098 A1Samsung Electro-Mechanics Co., Ltd.
Most cited
By later US patents
- Three-dimensional circuit component assembly and method corresponding thereto179US 4,833,568 A1989
- Injection molded printed circuits132US 5,220,488 AUFE Incorporated · 1993
- Metal substrated printed circuit91US 4,858,073 AAkzo America Inc. · 1989
- Liquid crystal display module having housing of C-shaped cross section86US 4,958,911 AJonand, Inc. · 1990
- Semiconductor device, method for manufacturing an electronic equipment, electronic equipment and portable information terminal79US 6,633,078 B2Mitsubishi Denki Kabushiki Kaisha · 2003