Printed circuit board and electronic device comprising same
AssigneeSamsung Electronics Co., Ltd.
InventorsJungje BANG, Byeongkeol KIM, Wonseob KIM, Yisu PARK, Hoyeon SEO, Jongbum LEE, Kisoo JUNG, Yunoh CHI
Life of this patent
Estimating the term…
Loading patent…
AssigneeSamsung Electronics Co., Ltd.
InventorsJungje BANG, Byeongkeol KIM, Wonseob KIM, Yisu PARK, Hoyeon SEO, Jongbum LEE, Kisoo JUNG, Yunoh CHI
Estimating the term…
An electronic device is provided. The electronic device including a board unit on which at least one electrical component is disposed, wherein the board unit includes a printed circuit board (PCB) including a metal wiring layer and a polymer substrate layer laminated on at least one surface of the metal wiring layer, the polymer substrate layer being hot-shaped to have a curved shape, and a bonding layer including a solder that electrically bonds the electrical component to at least a portion of the metal wiring layer, the bonding layer being configured to fix the electrical component on the board unit.
An electronic device comprising:
A method of manufacturing a board unit having a curved shape for an electronic device, the method comprising:
A board unit of an electronic device, which has a curved shape and on which an electrical component is placed, the board unit being positioned within the electronic device, the board unit comprising:
Dependencies are inferred from the claim text.