Non-planar printed circuit board (PCB) interposer for doubly curved conformal antenna array
AssigneeRockwell Collins, Inc.
InventorsJeremiah D. Wolf, James B. West, Jiwon L Moran
Life of this patent
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AssigneeRockwell Collins, Inc.
InventorsJeremiah D. Wolf, James B. West, Jiwon L Moran
Estimating the term…
A conformal interposer assembly for an electronically scanned array (ESA) includes a set of antenna-side conductive pads connected to an antenna element set into a printed circuit board (PCB) and conforming to a shared interconnection geometry, e.g., defining a single-axis, double-axis, or otherwise curved. Feed-side conductive pads are connected to a radio frequency (RF) feed board and likewise conform to a shared interconnection geometry, which may or may not conform to that of the antenna-side pads. Conductive vias conveys energy between the RF feed board and the antenna elements set into the PCB; for example, each conductive via may connect an antenna-side conductive pad and a counterpart feed-side conductive pad. Rigid dielectric interposers are disposed between the PCB and the feed board, providing insulation and physical bridging to the conductive vias and structural rigidity throughout the conformal assembly.
A conformal interposer assembly, comprising:
A conformal electronically scanned array (ESA) assembly, comprising:
Dependencies are inferred from the claim text.