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US 12,464,652 B2Granted
Manufacturing method of electronic device and electronic device
AssigneeInnolux Corporation
InventorsYing-Jen Chen, Yan-Zheng Wu
Life of this patent
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Abstract
A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.
Claims19
A manufacturing method of an electronic device, comprising:
- forming a curved substrate;
- forming a first conductive layer on a first insulating layer;
- forming a second conductive layer on a second insulating layer;
- and bonding the first insulating layer and the second insulating layer to the curved substrate, wherein bonding the first insulating layer and the second insulating layer to the curved substrate comprises:
- bonding a surface of the first insulating layer away from the first conductive layer to a first surface of the curved substrate;
- and bonding a surface of the second insulating layer away from the second conductive layer to a second surface of the curved substrate, wherein the first surface and the second surface are opposite to each other.
3 more elements
An electronic device, comprising:
- a substrate, having a first surface and a second surface opposite to the first surface, wherein the first surface is a convex surface and the second surface is a concave surface;
- a first conductive layer, disposed on the first surface of the substrate;
- a first insulating layer, disposed between the first conductive layer and the substrate;
- a second conductive layer, disposed on the second surface of the substrate;
- and
- a second insulating layer, disposed between the second conductive layer and the substrate,
- wherein an adhesive layer is disposed between the first insulating layer and the substrate and/or between the second insulating layer and the substrate,
- wherein the first conductive layer has an arc length along a specific direction, the arc length is between one-half of a wavelength of a signal transmitted between the first conductive layer and the second conductive layer and the wavelength of the signal,
- wherein a distance between the first conductive layer and the second conductive layer is between a quarter of a wavelength of a signal transmitted between the first conductive layer and the second conductive layer and the wavelength of the signal.
6 more elements
Dependencies are inferred from the claim text.