H05K 2201/09118
Moulded substrate
H05K2201/09118 (Moulded substrate) appears on 657 US grants and 582 published applications in this corpus.
Search patents in H05K- Granted patents
- 657
- Published applications
- 582
- Assignees
- 396
- Inventors
- 1,426
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 3 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 12 | 0 |
| 1988 | 6 | 0 |
| 1989 | 16 | 0 |
| 1990 | 25 | 0 |
| 1991 | 23 | 0 |
| 1992 | 17 | 0 |
| 1993 | 16 | 0 |
| 1994 | 9 | 0 |
| 1995 | 14 | 0 |
| 1996 | 3 | 0 |
| 1997 | 6 | 0 |
| 1998 | 11 | 0 |
| 1999 | 21 | 0 |
| 2000 | 13 | 0 |
| 2001 | 13 | 4 |
| 2002 | 14 | 17 |
| 2003 | 11 | 18 |
| 2004 | 16 | 38 |
| 2005 | 15 | 66 |
| 2006 | 21 | 15 |
| 2007 | 25 | 24 |
| 2008 | 8 | 18 |
| 2009 | 15 | 24 |
| 2010 | 17 | 23 |
| 2011 | 17 | 20 |
| 2012 | 10 | 16 |
| 2013 | 12 | 21 |
| 2014 | 12 | 25 |
| 2015 | 10 | 25 |
| 2016 | 21 | 36 |
| 2017 | 24 | 23 |
| 2018 | 20 | 29 |
| 2019 | 31 | 19 |
| 2020 | 15 | 21 |
| 2021 | 22 | 24 |
| 2022 | 20 | 27 |
| 2023 | 19 | 21 |
| 2024 | 22 | 12 |
| 2025 | 15 | 11 |
| 2026 | 6 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic structure and a method of manufacturing such11 Aug 2026US 12,707,567 B1Tacto Tek Oy
- Base member, electronic device, and structure2 Jun 2026US 12,648,078 B2Canon Kabushiki Kaisha
- Wiring component for electrical equipment21 Apr 2026US 12,609,517 B2Mitsubishi Electric Corporation
- Method for producing electrical circuitry on filled organic polymers14 Apr 2026US 12,604,413 B2
- Manufacturing methods of a planar transformer10 Feb 2026US 12,548,706 B2Apple Inc.
- Pcb stack element8 Oct 2026US 2026/0313801 A1Harting, S.A.
- Base member, electronic device, and structure17 Sep 2026US 2026/0282217 A1Canon Kabushiki Kaisha
- Printed circuit board of planar transformer and manufacturing method thereof21 May 2026US 2026/0142069 A1Apple Inc.
- Thermoplastic resin composition, molded article, and component for telecommunication apparatus30 Apr 2026US 2026/0117042 A1Asahi Kasei Kabushiki Kaisha
- Semiconductor module and insert molding method19 Mar 2026US 2026/0082485 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Vehicle lamp411US 5,038,255 AFurukawa Electric Co., Ltd. · 1991
- Plated plastic castellated interconnect for electrical components301US 5,069,626 AWestern Digital Corporation · 1991
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Method of forming a three-dimensional printed circuit assembly211US 5,264,061 AMotorola, Inc. · 1993