H05K 2201/09081
Tongue or tail integrated in planar structure
Official title: Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
H05K2201/09081 (Tongue or tail integrated in planar structure) appears on 325 US grants and 276 published applications in this corpus.
Search patents in H05K- Granted patents
- 325
- Published applications
- 276
- Assignees
- 207
- Inventors
- 653
- Latest grant
- 22 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 3 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 4 | 0 |
| 1991 | 5 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 4 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 7 | 0 |
| 1998 | 6 | 0 |
| 1999 | 5 | 0 |
| 2000 | 8 | 0 |
| 2001 | 8 | 2 |
| 2002 | 3 | 6 |
| 2003 | 6 | 2 |
| 2004 | 3 | 14 |
| 2005 | 6 | 15 |
| 2006 | 12 | 11 |
| 2007 | 9 | 11 |
| 2008 | 14 | 19 |
| 2009 | 6 | 11 |
| 2010 | 6 | 22 |
| 2011 | 8 | 23 |
| 2012 | 18 | 11 |
| 2013 | 23 | 15 |
| 2014 | 17 | 16 |
| 2015 | 17 | 15 |
| 2016 | 15 | 9 |
| 2017 | 13 | 10 |
| 2018 | 7 | 7 |
| 2019 | 10 | 9 |
| 2020 | 5 | 11 |
| 2021 | 7 | 10 |
| 2022 | 10 | 8 |
| 2023 | 5 | 10 |
| 2024 | 13 | 4 |
| 2025 | 5 | 4 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board assembly and electronic device22 Jul 2025US 12,369,249 B2Huawei Technologies Co., Ltd.
- Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices6 May 2025US 12,292,457 B2Technoprobe S.P.A.
- Sensor module, particularly for measuring ambient temperature29 Apr 2025US 12,285,994 B2Sensirion AG
- Method for producing a carrier arrangement8 Apr 2025US 12,273,993 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Battery interconnects4 Feb 2025US 12,218,385 B2CelLink Corporation
- Flexible mounting structures for surface mount components2 Apr 2026US 2026/0096027 A1Intel Corporation
- Electronic module, in particular an electronic power module for hybrid vehicles or electric vehicles16 Oct 2025US 2025/0324513 A1Robert Bosch GmbH
- Shared footprint for frontside and through-board connector on an led module17 Jul 2025US 2025/0234454 A1Signify Holding B. V.
- Method for producing a carrier arrangement19 Jun 2025US 2025/0203764 A1c/o Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Battery cell assembly including thermistor and method of manufacturing the same8 May 2025US 2025/0149664 A1LG Energy Solution, Ltd.
Most cited
By later US patents
- Microelectronic mounting with multiple lead deformation and bonding475US 5,518,964 ATessera, Inc. · 1996
- Method of fabricating compliant interface for semiconductor chip367US 5,659,952 ATessera, Inc. · 1997
- Rearview mirror constructed for efficient assembly308US 6,650,457 B2Gentex Corporation · 2003
- Microelectronic mounting with multiple lead deformation and bonding201US 5,801,441 ATessera, Inc. · 1998
- Fan-out semiconductor chip assembly189US 5,688,716 ATessera, Inc. · 1997