Probe card device
AssigneePrinco Corp.
InventorPei-Liang Chiu
Life of this patent
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Abstract
A probe card device is provided, including a thin film substrate having opposite first and second surfaces; a plurality of probe pins disposed over the first substrate of the thin film substrate, wherein the probe pins are not deformable, and the probe pins and the thin film substrate are integrally formed; a ceramic substrate formed by a crystal growth method or glass substrate, having a first surface and a second surface opposite to each other which are electrically connected, the first surface of the ceramic substrate or the glass substrate is disposed on the second surface of the thin film substrate, and is electrically connected to the thin film substrate; and the second surface of the ceramic substrate or the glass substrate are electrically connected to the second surface for electrical connection to another circuit board.
Claims9
A probe card device, comprising:
- a thin-film substrate having opposite first and second surfaces, wherein the thin-film substrate comprises a thin film body and a plurality of first connection points embedded in the thin film body;
- a plurality of probe pins disposed on the first surface of the thin film substrate, wherein one terminal of each of the probe pins is electrically connected to connection points embedded in the thin film body, and the other terminal of each of the probe pins is used to directly contact a chip contact of a chip for chip testing, wherein the probe pins are partially embedded in the thin film body, wherein the plurality of probe pins are not deformable, and the plurality of probe pins and the thin-film substrate are integrally formed;
- a ceramic substrate formed by crystal growth or glass substrate, having opposite first surface and second surfaces, wherein the ceramic substrate or the glass substrate comprises a plurality of vertical via holes filled with a conductive material, so that the first surface and the second surface of the ceramic substrate or the glass substrate are electrically connected, the first surface of the ceramic substrate or the glass substrate is disposed on the second surface of the thin film substrate and is electrically connected to the thin film substrate, wherein the ceramic substrate formed by crystal growth or glass substrate is processed by grinding and polishing, and then a dielectric layer is formed by spin coating or spray coating and baking and then the dielectric layer is attached to the ceramic substrate formed by crystal growth or glass substrate to form a completely sealed thin-film substrate with the probe pins;
- and
- a plurality of second connection points disposed on the second surface of the ceramic substrate or glass substrate to electrically connect to a circuit board.
A probe card device, comprising:
- a thin-film substrate having opposite first and second surfaces, wherein the thin-film substrate comprises a thin film body and a plurality of connection points embedded in the thin film body;
- a plurality of probe pins disposed on the first surface of the thin film substrate, wherein one terminal of each of the probe pins is electrically connected to connection points embedded in the thin film body, and the other terminal of each of the probe pins is used to directly contact a chip contact of a chip for chip testing, wherein the probe pins are partially embedded in the thin film body, wherein the plurality of probe pins are not deformable, and the plurality of probe pins and the thin-film substrate are integrally formed;
- a ceramic substrate formed by crystal growth or glass substrate, having opposite first surface and second surfaces, wherein the ceramic substrate or the glass substrate comprises a plurality of vertical via holes filled with a conductive material, so that the first surface and the second surface of the ceramic substrate or the glass substrate are electrically connected, the first surface of the ceramic substrate or the glass substrate is disposed on the second surface of the thin film substrate and is electrically connected to the thin film substrate, wherein the ceramic substrate formed by crystal growth or glass substrate is processed by grinding and polishing, and then a dielectric layer is formed by spin coating or spray coating and baking and then the dielectric layer is attached to the ceramic substrate formed by crystal growth or glass substrate to form a completely sealed thin-film substrate with the probe pins;
- and
- another thin film substrate disposed on the second surface of the ceramic substrate or the glass substrate to electrically connect to a circuit board.
Dependencies are inferred from the claim text.