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US 6,797,616 B2Granted
Circuit boards containing vias and methods for producing same
AssigneeMicron Technology, Inc.
InventorLarry D. Kinsman
Life of this patent
Estimating the term…
Abstract
The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.
Claims22
A method for producing an interconnecting device, comprising:
- embedding a plurality of homogenous, pre-formed electric conduction elements in an insulating substrate having first and second opposed surfaces, the electric conduction elements extending from the first surface to the second surface, wherein embedding further comprises positioning the electric conduction elements in a resin material in a semi-liquid state and curing the resin material to form the insulating substrate;
- applying a first insulating layer to the first surface of the insulating substrate and applying a second insulating layer to the second surface of the insulating substrate;
- removing a portion of the first insulating layer and a portion of the second insulating layer to form respective first and second openings exposing both ends of pre-selected electric conduction elements;
- applying a first conductive medium to overlie the first insulating layer, the first conductive medium extending into the first opening making physical contact with the exposed ends of the electric conduction elements;
- applying a second conductive medium to overlie the second insulating layer, the second conductive medium extending into the second opening making physical contact with the exposed ends of the electric conduction elements.
2 more elements
A method of fabricating an electronic device comprising:
- embedding a plurality of homogeneous, pre-formed electric conduction elements in an insulating substrate having first and second opposed surfaces, the electric conduction elements extending from the first surface to the second surface, wherein embedding further comprises positioning the electric conduction elements in a non-cured resin material and curing the resin material to form the insulating substrate;
- applying a first insulating layer to the first surface of the insulating substrate and applying a second insulating layer to the second surface of the insulating substrate;
- removing a portion of the first insulating layer and a portion of the second insulating layer to form respective first and second openings exposing both ends of pre-selected electric conduction elements;
- applying a first conductive medium to overlie the first insulating layer, the first conductive medium extending into the first openings making physical contact with the exposed ends of the electric conduction elements;
- applying a second conductive medium to overlie the second insulating layer, the second conductive medium extending into the second openings making physical contact with the exposed ends of the electric conduction elements;
- attaching a first electrical component to the first insulating layer in contact with the first conductive medium;
- and attaching a second electrical component to the second insulating layer in contact with the second conductive medium.
4 more elements
Dependencies are inferred from the claim text.