Probe card device
AssigneePrinco Corp.
InventorPei-Liang CHIU
Life of this patent
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Abstract
A probe device is provided, including a thin film substrate having opposite first and second surfaces; a plurality of probes disposed over the first substrate of the thin film substrate, wherein the probes are not deformable, and the probes and the thin film substrate are integrally formed; a ceramic substrate or glass substrate formed by a crystal growth method, having a first surface and a second surface opposite to each other which are electrically connected, the first surface of the ceramic substrate or the glass substrate is disposed on the second surface of the thin film substrate, and is electrically connected to the thin film substrate; and the second surface of the ceramic substrate or the glass substrate are electrically connected to the second surface for electrical connection to another circuit board.
Claims5
A probe card device, comprising:
- a thin-film substrate having opposite first and second surfaces;
- a plurality of probes are disposed on the first surface of the thin film substrate, wherein the plurality of probes are not deformable, and the plurality of probes and the thin-film substrate are integrally formed;
- a ceramic substrate or glass substrate formed by crystal growth, having opposite first surface and second surfaces, wherein the ceramic substrate or the glass substrate comprises a plurality of vertical via holes filled with a conductive material, so that the first surface and the second surface of the ceramic substrate or the glass substrate are electrically connected, the first surface of the ceramic substrate or the glass substrate is disposed on the second surface of the thin film substrate and is electrically connected to the thin film substrate;
- and
- a plurality of connection points disposed on the second surface of the ceramic substrate or glass substrate or another thin film substrate disposed on the second surface of the ceramic substrate or the glass substrate to electrically connect to a circuit board.
Dependencies are inferred from the claim text.