H05K 2201/09863
Concave hole or via
H05K2201/09863 (Concave hole or via) appears on 76 US grants and 73 published applications in this corpus.
Search patents in H05K- Granted patents
- 76
- Published applications
- 73
- Assignees
- 46
- Inventors
- 185
- Latest grant
- 14 Oct 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 2 |
| 2002 | 5 | 5 |
| 2003 | 5 | 5 |
| 2004 | 4 | 4 |
| 2005 | 2 | 1 |
| 2006 | 1 | 1 |
| 2007 | 2 | 3 |
| 2008 | 2 | 3 |
| 2009 | 2 | 1 |
| 2010 | 3 | 2 |
| 2011 | 1 | 2 |
| 2012 | 2 | 1 |
| 2013 | 2 | 1 |
| 2014 | 0 | 5 |
| 2015 | 2 | 2 |
| 2016 | 4 | 5 |
| 2017 | 2 | 2 |
| 2018 | 6 | 4 |
| 2019 | 3 | 3 |
| 2020 | 1 | 3 |
| 2021 | 4 | 2 |
| 2022 | 4 | 4 |
| 2023 | 2 | 2 |
| 2024 | 1 | 3 |
| 2025 | 2 | 4 |
| 2026 | 0 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Driving substrate and display device14 Oct 2025US 12,446,317 B2Hkc Corporation Limited
- Electronic device and manufacturing method thereof15 Jul 2025US 12,363,830 B2Carux Technology Pte. Ltd.
- Backplane footprint for high speed, high density electrical connectors17 Dec 2024US 12,171,063 B2Amphenol Corporation
- Backplane footprint for high speed, high density electrical connectors12 Sep 2023US 11,758,656 B2Amphenol Corporation
- Wiring substrate21 Feb 2023US 11,589,457 B2KYOCERA Corporation
- Pcb via design for power electronic applications and method for manufacturing30 Jul 2026US 2026/0223282 A1Mitsubishi Electric Corporation
- Electronic device and manufacturing method thereof26 Feb 2026US 2026/0059664 A1Innolux Corporation
- Resin multilayer substrate and circuit module29 Jan 2026US 2026/0032818 A1Murata Manufacturing Co., Ltd.
- Multilayer Cores, Variable Width Vias, and Offset Vias4 Sep 2025US 2025/0279341 A1Avago Technologies International Sales Pte. Limited
- Printed wiring board12 Jun 2025US 2025/0194008 A1KYOCERA Corporation
Most cited
By later US patents
- Pad grid array for receiving a solder bumped chip carrier132US 4,940,181 AMotorola, Inc. · 1990
- Multilayer wiring board and method for forming the same61US 6,010,769 AKabushiki Kaisha Toshiba · 2000
- Printed circuit board with metallized grooves57US 5,451,722 A1995
- Method for making printed circuit boards56US 5,390,412 A1995
- Multilayered printed circuit board and manufacturing method thereof56US 8,148,643 B2Ibiden Co., Ltd. · 2012