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US 12,363,830 B2Granted
Electronic device and manufacturing method thereof
AssigneeCarux Technology Pte. Ltd.
InventorsHsin-Fa Hsu, Yu-Ling Hung, Hsien-Yao Hsiao, Tsu-Hsien Ku
Life of this patent
Estimating the term…
Abstract
An electronic device is provided, including an electronic element, and a protective substrate. The protective substrate includes a concave portion, and a flat portion. The concave portion has a concave surface and a convex surface that is opposite to the concave surface. The flat portion is connected to the concave portion. The electronic element overlaps the concave portion and is arranged under the convex surface.
Claims16
An electronic device, comprising:
- an electronic element;
- and
- a protective substrate, comprising:
- a concave portion, having a concave surface and a convex surface that is opposite to the concave surface;
- a flat portion, connected to the concave portion;
- and,
- an attachment,
- characterized in that:
- the electronic element overlaps the concave portion and is arranged under the convex surface;
- the attachment is disposed between the electronic element and the convex surface;
- and
- the concave portion comprises at least one microstructure, wherein the at least one microstructure is adjacent to the electronic element and is in contact with the attachment.
9 more elements
A method of manufacturing an electronic device, comprising:
- forming a protective substrate, wherein the protective substrate comprises:
- a concave portion having a concave surface and a convex surface that is opposite to the concave surface;
- a flat portion, connected to the concave portion;
- and
- disposing an attachment between the concave portion and the electronic element, and fixing the concave portion and the electronic element by the attachment,
- characterized in that:
- the method further comprises:
- overlapping the electronic element with the concave portion and disposing the electronic element under the convex surface,
- wherein the protective substrate is formed by thermoforming, and
- forming a microstructure that is adjacent to the electronic element in the concave portion, wherein the microstructure is in contact with the attachment.
7 more elements
Dependencies are inferred from the claim text.