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US 2025/0194008 A1Published application
Printed wiring board
AssigneeKYOCERA Corporation
InventorsTomoya NAGASE, Nobuhiro SHIMADA
Life of this patent
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Abstract
A printed wiring board includes a first insulating layer and a through-hole conductor. The first insulating layer includes a through-hole passing through from a first surface of the first insulating layer to a second surface opposite the first surface. The through-hole conductor is located on an inner wall of the through-hole and includes a portion where an opening area in cross section parallel to the second surface increases from the first surface side toward the second surface side.
Claims13
A printed wiring board comprising:
- a first insulating layer;
- and
- a through-hole conductor,
- wherein
- the first insulating layer includes a through-hole passing through from a first surface of the first insulating layer to a second surface opposite the first surface, and
- the through-hole conductor is located on an inner wall of the through-hole and includes a portion where an opening area in a cross section parallel to the second surface increases from a side of the first surface toward a side of the second surface.
3 more elements
Dependencies are inferred from the claim text.