Pcb via design for power electronic applications and method for manufacturing
AssigneeMitsubishi Electric Corporation
InventorsPierre-Yves Pichon, Julien MORAND, Remi PERRIN
Life of this patent
Estimating the term…
Abstract
A circuit board comprises at least one epoxy-based composite material layer (130), at least two conductive layers or tracks (110, 120) on opposite sides of said epoxy-based composite material layer (130) and first metallized vias (140) connecting said conductive layers or tracks (110, 120), wherein at least some of said vias comprise a metallized barrel (141, 141′) ending with at least one flared end (β, 142′) at a junction between said metallized barrel and one of said conductive layers or tracks (110, 120).
Claims13
1-6. (canceled)
A method for manufacturing a circuit board with vias, comprising making said vias through forming holes in said epoxy based composite material in a direction perpendicular to said conductive layers using a laser beam configured for drilling said holes with a barrel, providing at least one flared end at a top and/or at a bottom of said barrel and filling said holes to provide said vias, wherein
- said method comprises some of said vias, providing a basement through a subtractive metallization process on a conductive layer or track on a substructure, laminating an epoxy layer on said conductive layer or track with basement, forming said hole in said epoxy layer and filling said hole on top of said basement with metal to form said metallized via positioned on top of said basement, said basement providing a first flared base for said via.
8-10. (canceled)
Dependencies are inferred from the claim text.