Electronic device and manufacturing method thereof

An electronic device, comprising:

• a first sub-perforation substrate, comprising a plurality of first perforations;
• and
• a second sub-perforation substrate, laminated to the first sub-perforation substrate and comprising a plurality of second perforations,
• wherein the first perforations at least partially overlap with the corresponding second perforations in a normal direction of the first sub-perforation substrate,
• wherein a misalignment between the second sub-perforation substrate and the first sub-perforation substrate in a first direction is less than or equal to 5 μm, and the first direction is perpendicular to the normal direction of the first sub-perforation substrate,
• wherein a thickness of one of the first perforations and one of the second perforations in the normal direction of the first sub-perforation substrate is less than or equal to 0.3 mm,
• wherein a maximum width of one of the first perforations and one of the second perforations in the first direction is less than or equal to 100 μm,
• wherein an angle between a side of the first sub-perforation substrate and the normal direction of the first sub-perforation substrate is less than or equal to 10 degrees, and an angle between a side of the second sub-perforation substrate and the normal direction of the first sub-perforation substrate is less than or equal to 10 degrees.