Circuit board structure and manufacturing method thereof
AssigneeUnimicron Technology Corp.
InventorsChin-Sheng Wang, Chen-Hao Lin, Ansheng Lee, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko
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Abstract
A circuit board structure and a manufacturing method thereof. The method includes: providing a temporary substrate; forming a dielectric layer having at least one through hole on the temporary substrate; forming a surface treatment layer on the temporary substrate in the at least one through hole; forming at least one pad on the surface treatment layer; forming a built-up structure on the dielectric layer; assembling the built-up structure to a substrate; removing the temporary substrate; and removing the dielectric layer.
Claims12
A circuit board structure, comprising:
- a built-up structure;
- at least one pad, disposed on the built-up structure;
- and
- a surface treatment layer, disposed on the at least one pad;
- and
- wherein, the surface treatment layer and the at least one pad are not overlapped with each other in a horizontal direction, and the horizontal direction is perpendicular to a stacking direction of the surface treatment layer and the at least one pad;
- wherein the at least one pad comprises a buried part and a protruding part, the buried part is buried in the built-up structure, the protruding part protrudes from the buried part, and at least a part of the protruding part is located outside the built-up structure.
A manufacturing method of circuit board structure, comprising:
- providing a temporary substrate;
- forming a dielectric layer having at least one through hole on the temporary substrate;
- forming a surface treatment layer on the temporary substrate in the at least one through hole;
- forming at least one pad on the surface treatment layer;
- forming a built-up structure on the dielectric layer;
- assembling the built-up structure to a substrate;
- removing the temporary substrate;
- and
- removing the dielectric layer;
- wherein the manufacturing method of circuit board structure further comprises:
- forming a seed layer on the surface treatment layer after forming the surface treatment layer;
- and
- removing a part of the seed layer after removing the dielectric layer.
A manufacturing method of circuit board structure, comprising:
- providing a temporary substrate;
- forming a dielectric layer having at least one through hole on the temporary substrate;
- forming a surface treatment layer on the temporary substrate in the at least one through hole;
- and
- forming at least one pad on the surface treatment layer;
- wherein the manufacturing method of circuit board structure further comprises:
- forming a seed layer on the surface treatment layer after forming the surface treatment layer;
- and
- removing a part of the seed layer after removing the dielectric layer.
Dependencies are inferred from the claim text.