H05K 2201/099
Coating over pads
Official title: Coating over pads, e.g. solder resist partly over pads
H05K2201/099 (Coating over pads) appears on 417 US grants and 474 published applications in this corpus.
Search patents in H05K- Granted patents
- 417
- Published applications
- 474
- Assignees
- 227
- Inventors
- 1,072
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 5 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 6 | 0 |
| 2001 | 15 | 7 |
| 2002 | 13 | 15 |
| 2003 | 20 | 13 |
| 2004 | 14 | 14 |
| 2005 | 10 | 26 |
| 2006 | 11 | 20 |
| 2007 | 12 | 31 |
| 2008 | 13 | 21 |
| 2009 | 17 | 33 |
| 2010 | 15 | 25 |
| 2011 | 21 | 18 |
| 2012 | 26 | 25 |
| 2013 | 13 | 21 |
| 2014 | 15 | 29 |
| 2015 | 23 | 23 |
| 2016 | 24 | 11 |
| 2017 | 14 | 13 |
| 2018 | 8 | 9 |
| 2019 | 15 | 12 |
| 2020 | 14 | 19 |
| 2021 | 9 | 9 |
| 2022 | 10 | 14 |
| 2023 | 11 | 15 |
| 2024 | 8 | 25 |
| 2025 | 16 | 16 |
| 2026 | 7 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board structure and manufacturing method thereof6 Oct 2026US 12,757,334 B2Unimicron Technology Corp.
- Printed circuit board8 Sep 2026US 12,733,094 B2Samsung Electro-Mechanics Co., Ltd.
- Wiring circuit board21 Jul 2026US 12,690,129 B2Nitto Denko Corporation
- Wiring board21 Apr 2026US 12,610,465 B2Shinko Electric Industries Co., Ltd.
- Sensor package structure and manufacturing method thereof14 Apr 2026US 12,604,420 B2Tong Hsing Electronic Industries, Ltd.
- Circuit board and semiconductor package comprising same8 Oct 2026US 2026/0313791 A1LG Innotek Co., Ltd.
- Printed circuit board8 Oct 2026US 2026/0313794 A1Samsung Electro-Mechanics Co., Ltd.
- Self-centering electrical contacts2 Jul 2026US 2026/0188932 A1Raytheon Company
- Printed circuit board18 Jun 2026US 2026/0173265 A1Samsung Electro-Mechanics Co., Ltd.
- Extended pad area to prevent printed circuit board damage28 May 2026US 2026/0150194 A1Kollmorgen Corporation
Most cited
By later US patents
- Substrate with reinforced contact pad structure116US 7,005,750 B2Advanced Semiconductor Engineering, Inc. · 2006
- Method for fabricating microelectronic assemblies109US 6,324,754 B1Tessera, Inc. · 2001
- Partially captured oriented interconnections for BGA packages and a method of forming the interconnections91US 6,913,948 B2International Business Machines Corporation · 2005
- Substrate for producing a soldering connection86US 7,271,484 B2Infineon Technologies AG · 2007
- Substrate structure of flip chip package85US 6,787,918 B1Siliconware Precision Industries Co., Ltd. · 2004