Sensor package structure and manufacturing method thereof
AssigneeTong Hsing Electronic Industries, Ltd.
InventorsYu-Hsiang Liu, Li-Chun Hung
Life of this patent
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Abstract
A sensor package structure and a manufacturing method thereof are provided. The sensor package structure includes a substrate, a first solder mask layer, a convex structure, a sensing chip, and an engaging layer. The first solder mask layer is disposed on the substrate. The convex structure is disposed on the first solder mask layer. The convex structure has a first stepped surface, and the first stepped surface is higher than an upper surface of the first solder mask layer. The sensing chip is disposed above the substrate. The engaging layer is adhered between the substrate and the sensing chip and covers the convex structure, such that the convex structure and the sensing chip are not in contact with each other.
Claims9
A sensor package structure, comprising:
- a substrate;
- a first solder mask layer disposed on the substrate;
- a convex structure disposed on the first solder mask layer, wherein the convex structure has a first stepped surface, and the first stepped surface is higher than an upper surface of the first solder mask layer;
- a sensing chip disposed above the substrate;
- and
- an engaging layer adhered between the substrate and the sensing chip, wherein the engaging layer covers the convex structure, such that the convex structure and the sensing chip are not in contact with each other.
Dependencies are inferred from the claim text.