Substrate for producing a soldering connection
AssigneeInfineon Technologies AG
InventorsMartin Reiss, Carsten Bender, Kerstin Nocke
Life of this patent
Estimating the term…
Abstract
A solderable device includes a substrate and a soldering pad overlying the substrate. A solder mask overlies the substrate and portions of the soldering pad. The solder mask has an opening that exposes a portion of the soldering pad. The opening has at least two edges that symmetrically overlie portions of the soldering pad.
Claims14
A solderable device comprising:
- a substrate;
- a soldering pad overlying the substrate, said soldering pad having a substantially round portion with a center part;
- a solder mask overlying the substrate and portions of the soldering pad;
- and
- the solder mask having an opening symmetrically positioned over said center part of said solder pad to expose selected portions of the soldering pad, the opening having at least two straight edges defining a chord across said round portion of said soldering pad and that symmetrically overlie portions of the soldering pad.
A substrate for producing a soldering connection to a second substrate with soldering pads arranged in particular in a grid-like manner already on the substrate surface, said substrate having holding means that are connected to the surface of the substrate and engage over an edge of at least one soldering pad in a clip-like manner so that it is possible for a soldering ball to be applied to the surface of said substrate, wherein the holding means of an individual soldering pad of a soldering pad arrangement are arranged and/or dimensioned in accordance with the loading—determined by simulation—of the individual soldering connection in such a way that potions of the holding means that engage over the edge of the soldering pad and the area portions of the holding means that are connected to the substrate area have, together with the soldering pad, an adhesion to the surface of the substrate which is greater than the determined mechanical loading that acts upon the respective soldering pad, and at the same time a sufficient cover and side area of the soldering pad remains free for producing the soldering connection.
Dependencies are inferred from the claim text.