Extended pad area to prevent printed circuit board damage

A printed circuit board comprising:

• an insulative layer;
• a conductive pad disposed over the insulative layer, the conductive pad defining a contact area for attachment of a conductor;
• and
• a solder mask layer disposed over the conductive pad,
• wherein the conductive pad extends underneath the solder mask layer to protect the insulative layer and to accommodate positional variation of the conductor during attachment.

A method of creating a connection on a printed circuit board, the printed circuit board including an electrically insulating base layer, the method comprising:

• placing a conductive pad adjacent the electrically insulating base layer, the conductive pad defining a contact area;
• coating the conductive pad with a solder mask such that the conductive pad extends beyond the contact area and underneath the solder mask to form a peripheral extension, the contact area remaining exposed;
• and
• attaching a conductor to the contact area using a joining process,
• wherein the peripheral extension accommodates positional variation of the conductor caused by spring force and protects the electrically insulating base layer from damage incurred during the joining process.