H05K 2201/09972
Partitioned
Official title: Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
H05K2201/09972 (Partitioned) appears on 422 US grants and 485 published applications in this corpus.
Search patents in H05K- Granted patents
- 422
- Published applications
- 485
- Assignees
- 280
- Inventors
- 1,171
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 5 | 0 |
| 1998 | 6 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 3 | 4 |
| 2002 | 5 | 10 |
| 2003 | 8 | 10 |
| 2004 | 5 | 13 |
| 2005 | 6 | 22 |
| 2006 | 13 | 28 |
| 2007 | 17 | 19 |
| 2008 | 16 | 23 |
| 2009 | 9 | 23 |
| 2010 | 13 | 21 |
| 2011 | 22 | 22 |
| 2012 | 16 | 31 |
| 2013 | 13 | 26 |
| 2014 | 21 | 27 |
| 2015 | 24 | 39 |
| 2016 | 25 | 16 |
| 2017 | 20 | 15 |
| 2018 | 21 | 17 |
| 2019 | 20 | 16 |
| 2020 | 22 | 27 |
| 2021 | 13 | 17 |
| 2022 | 19 | 22 |
| 2023 | 16 | 12 |
| 2024 | 12 | 11 |
| 2025 | 11 | 7 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Structurally enhanced filtering of circuit board planes18 Aug 2026US 12,713,518 B2Microsoft Technology Licensing, LLC
- Electrical control board, air conditioner outdoor unit, and air conditioner11 Aug 2026US 12,704,272 B2Gd Midea Air-Conditioning Equipment Co., Ltd.
- Vertical power supply system and manufacturing method of connection board21 Apr 2026US 12,610,453 B2Delta Electronics (Shanghai) Co., Ltd.
- Light source support assembly24 Feb 2026US 12,563,671 B2Valeo Vision
- Type-3 printed circuit boards (PCBS) with hybrid layer counts17 Feb 2026US 12,557,216 B2Intel Corporation
- Component Carrier With Components Shielded by Vertical Partitioning Structures Disconnected in a Shielding Region16 Jul 2026US 2026/0206600 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Molding compound application in printed circuit board by three dimensional (3d) stacking2 Jul 2026US 2026/0190232 A1Google Inc.
- Semiconductor storage device and board unit18 Jun 2026US 2026/0171166 A1Kioxia Corporation
- Component carrier and method for manufacturing a component carrier14 May 2026US 2026/0136463 A1AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Power supply module and electronic device16 Apr 2026US 2026/0107374 A1Delta Electronics (Shanghai) Co., Ltd.
Most cited
By later US patents
- Microstrip arrangement220US 6,266,016 B1Telefonaktiebolaget LM Ericsson (publ) · 2001
- System and method for attenuating the effect of ambient light on an optical sensor151US 7,227,156 B2Sensors for Medicine and Science, Inc. · 2007
- System and method for attenuating the effect of ambient light on an optical sensor129US 7,157,723 B2Sensors for Medicine and Science, Inc. · 2007
- Method of determining routes for a plurality of wiring connections and a circuit board produced by such a method112US 5,657,242 AHitachi, Ltd. · 1997
- Multilayer printed wiring board with plurality of ground layers forming separate ground planes106US 5,719,750 AMitsubishi Denki Kabushiki Kaisha · 1998