Molding compound application in printed circuit board by three dimensional (3d) stacking

A packaging structure, comprising:

• a first printed circuit board (PCB) having a first top surface and a first bottom surface;
• a first electronic component on the first top surface of the first PCB;
• a first molding compound layer on the first top surface of the first PCB and covering the first electronic component;
• an interposer frame PCB below the first bottom surface of the first PCB;
• and
• a second PCB having a second top surface,
• wherein the second PCB is stacked below the first PCB through the interposer frame PCB such that the second top surface of the second PCB faces the first bottom surface of the first PCB, and a second electronic component is disposed inside the interposer frame PCB.

A method of manufacturing a packaging structure including a first printed circuit board (PCB) and a second PCB, wherein the first PCB has a first top surface and a first bottom surface that is opposite to the first top surface, the second PCB has a second top surface and a second bottom surface that is opposite to the second top surface, the method comprises:

• disposing a first electronic component on the first top surface of the first PCB;
• forming a first molding compound layer on the first top surface of the first PCB to cover the first electronic component;
• and
• stacking the first PCB above the second PCB such that the second top surface of the second PCB faces the first bottom surface of the first PCB.