Component Carrier With Components Shielded by Vertical Partitioning Structures Disconnected in a Shielding Region

A method of manufacturing a component carrier, the method comprising:

• providing a stack which comprises at least one electrically conductive layer structure and at least one electrically insulating layer structure;
• arranging at least two components on and/or in the stack side-by-side and divided by a space;
• forming at least one electrically conductive first vertical partitioning structure and at least one electrically conductive second vertical partitioning structure, wherein the at least one of the electrically conductive vertical partitioning structures is arranged at least partially in the space, and wherein each of the electrically conductive vertical partitioning structures, in a plan view on the stack, surrounds at least partially at least one of the at least two components;
• and
• configuring the at least one electrically conductive first vertical partitioning structure and the at least one electrically conductive second vertical partitioning structure to interact with one of the at least one electrically conductive layer structure for shielding the at least two components, wherein the at least one electrically conductive first vertical partitioning structure and the at least one electrically conductive second vertical partitioning structure are disconnected from each other in a shielding region around the at least two components.