Type-3 printed circuit boards (PCBS) with hybrid layer counts

A printed circuit board comprising:

• a first circuit board portion comprising a set of first conducting layers and one or more plated through hole (PTH) vias formed through the first conducting layers;
• a second circuit board portion comprising a set of second conducting layers, wherein an area of the second circuit board portion is less than an area of the first circuit board portion and the second circuit board portion is coupled to the first circuit board portion via a laminate layer such that the first and second conducting layers are parallel with one another wherein the second circuit board portion is coupled to a first surface of the first circuit board portion;
• one or more PTH vias formed through the first and second conducting layers in an area of the printed circuit board where the first and second circuit board portions overlap;
• and power delivery circuitry coupled to a second surface of the first circuit board portion opposite the first surface, the power delivery circuitry connected to one or more of the PTH vias formed through the first and second conducting layers;
• input/output (IO) circuitry coupled to one or more of the PTH vias formed through the first conducting layers:
• and a socket to receive a device comprising a processor, the socket coupled to the first circuit board portion and connected to one or more of the PTH vias formed through the first conducting layers.