Semiconductor storage device and board unit
AssigneeKioxia Corporation
InventorKazuyuki NIITSUMA
Life of this patent
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Abstract
A semiconductor storage device according to one embodiment includes a first board and a second board. The first board includes a first portion, a second portion thinner than the first portion, and a plurality of first conductive portions on the second portion. The second board includes a plurality of second conductive portions. The plurality of second conductive portions overlap the plurality of first conductive portions when viewed from a first direction which is a thickness direction of the first board. The plurality of second conductive portions are connected to the plurality of first conductive portions by solder in one-to-one correspondence.
Claims20
A semiconductor storage device comprising:
- a first board including a first portion, a second portion, and a plurality of first conductive portions, the second portion being thinner than the first portion, the plurality of first conductive portions being on the second portion;
- and
- a second board including a plurality of second conductive portions, wherein
- the plurality of second conductive portions overlap the plurality of first conductive portions when viewed from a first direction which is a thickness direction of the first board, and
- the plurality of second conductive portions are connected to the plurality of first conductive portions by solder in one-to-one correspondence.
A board unit comprising:
- a first board including a first portion, a second portion, and a plurality of first conductive portions, the second portion being thinner than the first portion, the plurality of first conductive portions being on the second portion;
- and
- a second board including a plurality of second conductive portions, wherein
- the plurality of second conductive portions overlap the plurality of first conductive portions when viewed from a first direction which is a thickness direction of the first board, and
- the plurality of second conductive portions are connected to the plurality of first conductive portions by solder in one-to-one correspondence.
Dependencies are inferred from the claim text.